简介
本课程演示了普通8脚芯片焊接、BIOS芯片焊接。
先拆：调整风挡，围绕芯片引脚旋转加热，当锡融化后用镊子夹起芯片。
装：焊盘加锡，使之饱满光亮；镊子夹住芯片，对准脚位，快速旋转风枪，使锡融化，当锡融化后，镊子夹着芯片前后左右轻微移动，使引脚和焊盘充分接触，若有空焊，可以烙铁适当补锡。
学习目录
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授课老师
月饼
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